JPH0721329Y2 - Ｌｅｄアレ−ヘツド - Google Patents

Ｌｅｄアレ−ヘツド

Info

Publication number
JPH0721329Y2
JPH0721329Y2 JP1986179196U JP17919686U JPH0721329Y2 JP H0721329 Y2 JPH0721329 Y2 JP H0721329Y2 JP 1986179196 U JP1986179196 U JP 1986179196U JP 17919686 U JP17919686 U JP 17919686U JP H0721329 Y2 JPH0721329 Y2 JP H0721329Y2
Authority
JP
Japan
Prior art keywords
substrate
led
led chip
array head
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986179196U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6384352U (en]
Inventor
眞司 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP1986179196U priority Critical patent/JPH0721329Y2/ja
Publication of JPS6384352U publication Critical patent/JPS6384352U/ja
Application granted granted Critical
Publication of JPH0721329Y2 publication Critical patent/JPH0721329Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Laser Beam Printer (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
JP1986179196U 1986-11-21 1986-11-21 Ｌｅｄアレ−ヘツド Expired - Lifetime JPH0721329Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986179196U JPH0721329Y2 (ja) 1986-11-21 1986-11-21 Ｌｅｄアレ−ヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986179196U JPH0721329Y2 (ja) 1986-11-21 1986-11-21 Ｌｅｄアレ−ヘツド

Publications (2)

Publication Number Publication Date
JPS6384352U JPS6384352U (en]) 1988-06-02
JPH0721329Y2 true JPH0721329Y2 (ja) 1995-05-17

Family

ID=31122042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986179196U Expired - Lifetime JPH0721329Y2 (ja) 1986-11-21 1986-11-21 Ｌｅｄアレ−ヘツド

Country Status (1)

Country Link
JP (1) JPH0721329Y2 (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2805550B2 (ja) * 1991-05-31 1998-09-30 京セラ株式会社 画像装置
JP3656715B2 (ja) * 1999-07-23 2005-06-08 松下電工株式会社 光源装置
JP4905163B2 (ja) * 2007-01-31 2012-03-28 カシオ計算機株式会社 発光装置及び印刷装置
JP4967693B2 (ja) * 2007-01-31 2012-07-04 カシオ計算機株式会社 発光装置及び印刷装置
JP6108794B2 (ja) * 2012-11-29 2017-04-05 シチズン時計株式会社 発光装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598074B2 (ja) * 1979-01-23 1984-02-22 沖電気工業株式会社 発光素子アレイ装置
JPS60117154U (ja) * 1984-01-17 1985-08-08 沖電気工業株式会社 光学式記録ヘツド
JPS61123555U (en]) * 1985-01-19 1986-08-04

Also Published As

Publication number Publication date
JPS6384352U (en]) 1988-06-02

Similar Documents

Publication Publication Date Title
US5045867A (en) Optical writing head with curved surface formed by one end of any optical fiber bundle
JP3572924B2 (ja) 発光装置及びそれを用いた記録装置
US4820013A (en) LED array head
JPH059698Y2 (en])
JPH0721329Y2 (ja) Ｌｅｄアレ−ヘツド
US5285217A (en) Led exposure head
JP2524507B2 (ja) 光書込みヘッド
JP2790832B2 (ja) Ｌｅｄプリントヘッド
JP2000082720A (ja) 発光装置、露光装置及び画像形成装置
JPH0725060A (ja) 光プリントヘッドおよびその製造方法
JP2565701B2 (ja) 光書き込みヘッド
JPH0250854A (ja) Ｌｅｄプリントヘッド
JP2521106B2 (ja) 光書込みヘッド
JPH054365Y2 (en])
JPH01122459A (ja) 光書込みヘッド
TW565920B (en) Light emitting element array module and printer head and micro-display using the same
JPH02122955A (ja) 光プリンタヘッド
JP3049174B2 (ja) 密着型イメージセンサユニット
JP2002043635A (ja) 発光素子アレイチップ及びそれを用いた光プリンタヘッド
JPH05238059A (ja) 画像装置
JP3003822B2 (ja) 画像形成装置
JP2002029084A (ja) 光書込みヘッドおよびその組立方法
JPS63256465A (ja) 発光ダイオ−ド素子アレイ
JP2866519B2 (ja) 画像装置
JPH05241399A (ja) 背面露光装置